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Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly

Ching-I Chen, Ching-Yu Ni, Cheng-Chung Lee, Hsin-Yu Pan, Tsorng-Dih Yuan
Dept. of Mech. Eng., Chung Hua Univ., Hsinchu
IEEE Transactions on Electronics Packaging Manufacturing, 2007

@article{chen2007mechanical,

   title={Mechanical characterization and performance optimization for GPU fan-sink cooling module assembly},

   author={Chen, C.I. and Ni, C.Y. and Lee, C.C. and Pan, H.Y. and Yuan, T.D.},

   journal={Electronics Packaging Manufacturing, IEEE Transactions on},

   volume={30},

   number={3},

   pages={173–181},

   issn={1521-334X},

   year={2007},

   publisher={IEEE}

}

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Three GPU fan-sink cooling module assembly mounting mechanisms are mechanically characterized to determine the relationships between the clamping forces and screw torques. The first-order screw torque solutions are determined from the statistical regressions according to current industry recommendations. The screw tension force theoretical solution is derived for application to the finite-element model to assess the stress distributions on the thermal interface material (TIM) and solder joint layers by varying the retention sizes. The analysis results and stress differences are defined as the design objectives to optimize the retention design. Two optimized retentions are obtained from the characteristic stress difference curves accordingly. Through the thermal resistance measurement validation, the proposed retention designs improve the thermal performance to indicate less gap distance variation in the TIM. In addition, Better solder joint reliability can be obtained.
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