2707
Ahmed Al Maashri, Guangyu Sun, Xiangyu Dong, Vijay Narayanan and Yuan Xie
Graphics Processing Units (GPUs) offer tremendous computational and processing power. The architecture requires high communication bandwidth and lower latency between computation units and caches. 3D die-stacking technology is a promising approach to meet such requirements. To the best of our knowledge no other study has investigated the implementation of 3D technology in GPUs. In this […]
View View   Download Download (PDF)   

* * *

* * *

Follow us on Twitter

HGPU group

1735 peoples are following HGPU @twitter

Like us on Facebook

HGPU group

368 people like HGPU on Facebook

HGPU group © 2010-2016 hgpu.org

All rights belong to the respective authors

Contact us: